Effect of compatibilization and nanoclay inclusion on the thermal dependency of Young's moduli of wood/polymer composites

CELL 173

Max E. Hetzer, mhetzer@tulane.edu, Department of Chemical and Biomolecular Engineering, Tulane University, 300 Lindy Boggs Center, New Orleans, LA 70118, Daniel De Kee, ddekee@tulane.edu, Department of Chemical and Biomolecular Engineering and Tulane Institute for Macromolecular Engineering and Science, Tulane University, New Orleans, LA 70118, and Tony Poloso, ExxonMobil Chemical Company, Baton Rouge, LA 70791.
The addition of wood flour to a polymer matrix improves its mechanical and thermal properties. Compatibilizers such as maleic anhydride modified polyethylene (MAPE) are used to enhance the interfacial adhesion between the wood fibers and the polymer. The addition of nanoclay to wood/polymer composites (WPC) in the presence of MAPE, reduces its linear coefficient of thermal expansion (CTE) and increases its heat deflection temperature (HDT) without affecting the processability. Blending of high and low molecular weight (MW) compatibilizers resulted in improved mechanical and thermal properties of wood/polymer/clay nanocomposites (WPCNs). In particular, we report here on the effect of compatibilization and nanoclay inclusion on the thermal dependence of the Young's moduli of WPCNs.
 

Cellulose-Based and Other Green Composites
12:55 PM-3:45 PM, Monday, April 7, 2008 Morial Convention Center -- Rm. 232, Oral

Division of Cellulose & Renewable Materials

The 235th ACS National Meeting, New Orleans, LA, April 6-10, 2008