Thermal analysis of polyimide blends made from aromatic dianhydrides

CHED 683

Mario F. Sanders, msander2@gram.edu, Department of Chemistry, Grambling State University, 403 Main Street, GSU Box 4218, Grambling, LA 71245 and Danny Hubbard, hubbardd@gram.edu, Department of Chemistry/ LS LAMP Program, Grambling State University, 403 Main Street, GSU Box 4218, Grambling, LA 71245.
Polyimides are known to exhibit high glass transition temperatures and have been used in various high temperature applications (e.g., as military engine components). The focus of this research investigation was to prepare polyimides from the reaction of Bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride and 2,2'-Bis(p-aminophenoxy)biphenyl; and to assess their potential use in high temperature applications. Our data showed that the time and temperature parameters for optimal resin disk formulations were critical to the time and temperature experienced used to heat cure the resin powders before mold process was begun. The polymer products were (heat) cured at high temperatures not exceeding 600 oF using a twenty four (24) hour heat “staging” protocol. Thermal events are presented in this work that showed the glass transition temperature of the materials formed for both neat resin disks and post formulations.
 

Undergraduate Research Poster Session: Polymer Chemistry
11:00 AM-1:00 PM, Monday, April 7, 2008 Morial Convention Center -- Hall A, Poster

Division of Chemical Education

The 235th ACS National Meeting, New Orleans, LA, April 6-10, 2008