Instability in nanoimprinted structures

PMSE 146

Kyle J. Alvine, kalvine@nist.gov1, Hyun Wook Ro2, Yifu Ding, yding@nist.gov2, Brian Okerberg1, Jack F. Douglas, jack.douglas@nist.gov1, Alamgir Karim, alamgir.karim@nist.gov1, and Christopher L. Soles, christopher.soles@nist.gov1. (1) Polymers Division, National Institute of Standards and Technology, 100 Bureau Drive, MS 8541, Gaithersburg, MD 20899, (2) Polymers Division, NIST, 100 Bureau Drive, Stop 8541, Gaithersburg, MD 20899-8541
In order to meet the demand for producing smaller and more dense nanoscale patterns, NanoImprint Lithography must address the dual challenges of mold release and feature thermal stability. Fluorinated additives in the polymer can reduce mold adhesion and improve release properties. The effects of these additives on the thermal stability of nanopatterns are not well understood. Here we present studies on the thermal stability of nanoscale diffraction patterns created with thermal embossing NanoImprint lithography with fluorosurfactant additives.