I&EC 46 |
| It is known that differences between the coefficients of thermal expansion (CTE) of circuit boards and dies contribute to early fatigue failure of solder interconnects. In flip-chip packaging, the CTE mismatch is mitigated by the use of underfill which is a highly filled epoxy resin system. Micro-scale filler particles used traditionally in adhesive compositions have been effective in providing the desirable low CTE underfills for electronic packaging. However, high concentration of large filler particles in these underfills is problematic. Nano-scale filler particles can produce similar large improvement in properties yet at much lower concentrations primarily because of their large surface to volume ratio. We report here on epoxy resin nanocompositions that have exceptional thermal and mechanical properties as well as excellent processing characteristics. They are partly based on multifunctional low viscosity epoxy resins containing functionalized nanoparticles of Boehmite or silica. We will show that nano-scale particles are key to the development of these properties. |
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IEC Poster Session
8:00 PM-10:00 PM, Tuesday, August 21, 2007 BCEC -- Exhibit Hall - B2, Poster
Sci-Mix
Division of Industrial & Engineering Chemistry |