3-D Electrically interconnected nanowire networks formed by fluidic diffusion bonding

COLL 169

Zhiyong Gu, Zhiyong_Gu@uml.edu1, Hongke Ye, Hongke.Ye@jhu.edu2, Adam Bernfeld, bernfeld@jhu.edu2, and David H. Gracias, dgracias@jhu.edu3. (1) Department of Chemical Engineering, University of Massachusetts, One University Ave, Lowell, MA 01854, (2) Department of Chemical and Biomolecular Engineering, Johns Hopkins University, 3400 N Charles Street, Baltimore, MD 21218, (3) Department of Chemical and Biomolecular Engineering and Department of Chemistry, Johns Hopkins University, 3400 N Charles Street, 125 Maryland Hall, Baltimore, MD 21218
We demonstrate a new strategy to bond nanowires (NWs) using fluidic interfacial diffusion bonding of gold (Au), The strategy was used to form very large scale, electrically interconnected three dimensional, NW networks, composed of both homogeneous and heterogeneous (multisegmented) NWs. The size of the networks ranged from tens micrometers to millimeters. We have measured the electrical characteristics of the networks and explored one application of the networks in 3D spatial chemical sensing.
 

Fundamental Research in Colloid and Surface Chemistry
6:00 PM-8:00 PM, Monday, August 20, 2007 BCEC -- East Registration, Poster

Division of Colloid & Surface Chemistry

The 234th ACS National Meeting, Boston, MA, August 19-23, 2007