INOR 759 |
| We have created copper nanowires by electroless metal deposition onto DNA. A silicon surface derivatized with chlorodimethyloctadecylsilane has DNA aligned on it and is treated with Ag+. The entire substrate is then immersed for ~3 minutes in an electroless copper plating solution at 40 °C. The plating bath is a basic, aqueous solution of Cu2+ that contains tartrate ion as a complexing agent and formaldehyde as a reductant. Atomic force and scanning electron microscopy images show that these DNA-templated copper nanowires are 10 to 100 nm in diameter and are continuous over distances up to 70 μm. We are currently working to create DNA-templated copper nanowires that cross micropatterned electrodes to allow us to measure the conductivity properties of these systems using a low-current microprobe station. Straightforward methods for making highly conductive copper nanowires should facilitate the development of nanoelectronic devices. |
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Nanoscience: Synthesis
7:00 PM-10:00 PM, Tuesday, 12 September 2006 Moscone Center -- Hall D, Poster
Division of Inorganic Chemistry |