Printing solid inks

POLY 317

Ralph G. Nuzzo, School of Chemical Sciences and the Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S. Goodwin Avenue, Urbana, IL 61801
I will describe the considerable progress made in our recent (and highly collaborative) work on the development of new approaches to soft-lithography, ones that greatly extend its capabilities. The development of new approaches for printing large area sub-micron resist features frame one element of the unique capabilities that have come from our recent work. Perhaps more intriguing, though, are advances that have been made in recent research for printing functional forms of materials—solid inks—that yield systems with exceptional and here-to-fore inaccessible properties. It is now possible, using methods of soft-lithographic patterning, to print complex materials structures of very diverse form—single-crystalline semiconductor thin films, multilayer junctions, dielectrics, metals, and complex biological solids frame the palette of colors that can be accessed.

The construction of high performance macroelectronic circuits, new forms of optical devices appropriate for high sensitivity bio analytical measurement, and devices for energy conversion are among the examples that will be highlighted as demonstrations of the emerging opportunities for new forms of fabrication enabled by soft-lithography.