Quantifying the mechanisms of adhesion and release in imprint lithography

POLY 316

Edwin P. Chan, epc@mail.pse.umass.edu, Douglas P. Holmes, John Whang, and Alfred J. Crosby, crosby@mail.pse.umass.edu. Department of Polymer Science and Engineering, University of Massachusetts, 120 Governors Drive, Amherst, MA 01003
Imprint based technologies such as step and flash imprint lithography (S-FIL)and nanoimprint lithography (NIL) are emerging lithographic technologies that replicate nanoscale topographic features over large macroscopic areas via physical templating. Critical to the imprinting process is the proper separation of the template from the imprinted material after imprinting. While the issue of release is actively being addressed by various researchers, more studies are required to understand the underlying mechanisms in controlling release. The current approach to promoting proper release is to minimize the surface energy of the template by modifying its surface properties. This approach is quite straightforward and is successful in improving the release of the imprint template. However, as we illustrate, the release mechanism is not only dictated by the surface chemistry but also by the local mechanical properties of the materials near the interface. In this report, we will focus on studying the effects of template modulus on the release characteristics of nanoimprint lithography. Our goals for this work include: 1) developing a metrology to quantify the stress development during the imprinting process and ultimately 2) linking material properties of the template to the adhesion and release mechanisms of the imprinting process.