SAM-mediated electrodeposition of patterned nanostructures

COLL 288

Peter C. Searson1, N. S. Pesica1, and Kathleen J. Stebe2. (1) Department of Materials Science and Engineering, JHU, 102 Maryland Hall, 3400 North Charles Street, Baltimore, MD 21218, (2) Department of Chemical Engineering, Johns Hopkins University, 3400 North Charles Street, Baltimore, MD 21218
Creating features on the micro and nanoscale is of interest for a wide range of applications including data storage devices, flat screen displays, and sensors. In using soft lithography for fabricating patterned structures, it is essential to control the location of deposition and to be able to build up three dimensional structures. We show that surfactant molecules (e.g. octadecanethiol) transferred to a surface (e.g. gold) using a patterned polymer-based stamp can act as either a positive or negative resist for electrodeposition of patterned structures. Further, we show that sequential deposition exploiting directed deposition can be used to fabricate multicomponent, three dimensional structures.